SMT Production

PCBA MANUFACTURING CAPABILITY

PCB Layers

1 to 36 layers (standard)

PCB material/type

FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger

Assembly service type

DIP/SMT or Mixed SMT & DIP

Copper thickness 0.5um-4um

Assembly surface finish

HASL,ENIG,OSP

PCB Dimension 600x1200mm

IC Pitch(min) 0.2mm

Chip Size(min) 0201

Leg distance(min) 0.3mm

BGA Size 8x6mm~55x55mm

SMT Efficiency

SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA

u-BGA ball dia. 0.2mm

Required Docs for PCBA

Gerber file with BOM list & Pick-N-Place File(XYRS)

SMT speed

CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs